LED Indication - Discrete

Inspection Process

Complete Visual inspection.

Data sheet verification.

Device marking tests.

Component surface analysis.

Extensive use of high powered microscopy and digital photography.

X-Ray analysis, including in-tape reel-to-reel and in-tray inspections.

X-Ray Fluorescence Spectroscopy (XRF) testing.

Mechanical and Chemical De-capsulation, with microscopic die inspection.

Solderability testing.

Electrical testing.

Component blank check, erasing, and programming.

Quality Assurance

Electronic Components Distributor - XIAN NENG TECHNOLOGY, we have a total commitment to quality and customer satisfaction,

from the bottom of the organization to the top. Our corporate goal is to be 100% accurate on every order that we process.We achieve this goal by utilizing thorough vendor management and inspection processes to ensure component and supply chain integrity. XIAN NENG TECHNOLOGY evaluates and selects vendors based on their ability to supply product in accordance with XIAN NENG TECHNOLOGY quality standards. Criteria for selection, evaluation, and re-evaluation have been established. Records of the results of evaluations and any necessary corrective actions arising from the evaluations are maintained in order to prevent the purchase of counterfeit, suspect, and/or unapproved products. XIAN NENG TECHNOLOGY uses a comprehensive due diligence inspection program for all product prior to customer delivery. This quality control process applies to both commercial and military electronic components.all products that we receive are inspected in our state-of-the-art facility located in HongKong. We want our customers to have complete peace of mind knowing that every part shipped from XIAN NENG TECHNOLOGY has been thoroughly inspected and has passed our rigorous inspection procedures.