|
Package |
Tray |
|
Product Status |
Active |
|
Number of LABs/CLBs |
30300 |
|
Number of Logic Elements/Cells |
530250 |
|
Total RAM Bits |
21606000 |
|
Number of I/O |
520 |
|
Voltage - Supply |
0.922V ~ 0.979V |
|
Mounting Type |
Surface Mount |
|
Operating Temperature |
0°C ~ 100°C (TJ) |
|
Package / Case |
1156-BBGA, FCBGA |
|
Supplier Device Package |
1156-FCBGA (35x35) |
|
Base Product Number |
XCKU040 |
Documents & Media
| RESOURCE TYPE | LINK |
|---|---|
| Datasheets |
Kintex UltraScale FPGA Datasheet Wireless Bluetooth® Low Energy Modules Overview |
| Environmental Information |
Xiliinx RoHS Cert Xilinx REACH211 Cert |
| Featured Product | TE0841 Series with Xilinx Kintex® UltraScale™ KU35/KU40 |
| PCN Design/Specification |
Quality Alert 24/Nov/2015 Ultrascale & Virtex Dev Spec Chg 20/Dec/2016 |
| HTML Datasheet | Kintex® UltraScale™ FPGA Datasheet |
| EDA Models | XCKU040-2FFVA1156E - Models |

Quality Assurance
Electronic Components Distributor - XIAN NENG TECHNOLOGY, we have a total commitment to quality and customer satisfaction, from the bottom of the organization to the top. Our corporate goal is to be 100% accurate on every order that we process. We achieve this goal by utilizing thorough vendor management and inspection processes to ensure component and supply chain integrity. XIAN NENG TECHNOLOGY evaluates and selects vendors based on their ability to supply product in accordance with XIAN NENG TECHNOLOGY quality standards. Criteria for selection, evaluation, and re-evaluation have been established. Records of the results of evaluations and any necessary corrective actions arising from the evaluations are maintained in order to prevent the purchase of counterfeit, suspect, and/or unapproved products. XIAN NENG TECHNOLOGY uses a comprehensive due diligence inspection program for all product prior to customer delivery. This quality control process applies to both commercial and military electronic components.all products that we receive are inspected in our state-of-the-art facility located in HongKong. We want our customers to have complete peace of mind knowing that every part shipped from XIAN NENG TECHNOLOGY has been thoroughly inspected and has passed our rigorous inspection procedures. In-house inspection capabilities include:
Complete Visual inspection.
Data sheet verification.
Device marking tests.
Component surface analysis.
Extensive use of high powered microscopy and digital photography.
X-Ray analysis, including in-tape reel-to-reel and in-tray inspections.
X-Ray Fluorescence Spectroscopy (XRF) testing.
Mechanical and Chemical De-capsulation, with microscopic die inspection.
Solderability testing.
Electrical testing.
Component blank check, erasing, and programming.
Our traceability commitment
Traceability features must be tailored to the specific business needs of each customer, no matter how complex the manufacturing and assembly process.This is why we verify that all electronic components and all products we supply are photographed without exception and can be fully tracked from supplier to shipment.
Stringent vendor screening standards
XIANNENG has resources to ensure that you're never at a loss. Preferred access to electronic components that are in high demand. Relationships with trusted suppliers around the world. Stringent vendor screening standards so we never compromise on quality. XIANNENG proactively develops and exercises a vast network of qualified supply channels to deliver unit cost reduction (PPV) to our OEM, EMS, and distribution partners. Our skilled commodity analysts and sourcing teams utilize our unique tools and strategic supply partner relationships to quickly identify needle-moving cost improvement opportunities to items on your BOM.
contact us
If you are interested in our parts, please send an email directly to sales18@xiannenghk.com, or click on the instant chat tool in the top right corner, and we will contact you in time.
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